Why do wafers need back grinding?
Wafer thinning methods and considerations for grinding-wheel selection.
Read original guide ↗RESOURCES
Knowledge for your process.
Technical reading, grinding-wheel selection considerations and answers for your enquiry.
Technical Guides
PCD tools for CFRP machining
A supplied article on abrasive composites, delamination and fibre tearing.
Read original guide ↗PDC cutters for deep hard rock
Cutter geometry and selection considerations for drilling applications.
Read original guide ↗Grinding Wheel Selection
Define the application before choosing the wheel.
Prepare your process information
- Workpiece material and grinding operation
- Machine model and wheel mounting dimensions
- Required geometry, surface finish and inspection criteria
- Existing wheel specification, grit and concentration if known
Explore the available range
The supplied range includes diamond and CBN wheels with resin, vitrified, metal and electroplated bonds. The appropriate specification requires application-specific confirmation.
Explore grinding-wheel expertise ↗FAQ
What should I provide for wheel selection?
Share the workpiece material, operation, machine, wheel dimensions and intended surface finish. Include the current wheel specification when available.
Can I discuss a custom tool?
The supplied materials describe non-standard dimensions, grit, concentration and cutting-tool geometry. The scope for your drawing requires individual review.
Are minimum quantities and lead times fixed?
Terms require confirmation for the particular product and order. No universal lead time or minimum quantity is stated here.
Downloads
Approved catalogues, technical data sheets and downloadable files are pending confirmation.
No unverified document is offered for download.
Request product information